Here are details, I also included the 1 reference lecture slide and project sample (but project sample is for different topic). I need 4 pages on this not including the reference page.  Project#3 3D  Packaging   Chip on Chip, Wafer on Wafer, Package on Package stacking, interconnects like  Though Silicon Vias, Through Package Vias,  Assembly/processes, advantages/disadvantages  etc   •Literature review […]